Surprisingly Useful AI Article Enhancements
MSI has unveiled the technologies and components that will comprise the thermal coolers adorning its next-gen graphics cards, motherboards and other PC components. They include new engineering techniques, new fan designs and new composite materials – which feature copper melded with diamonds.
You can watch the overview in the following short video or read-on in more detail below…
Firstly, there’s the move to all-metal fans. This improves rigidity which reduces deformation at high speeds. It also makes the blades 40 per cent thinner (just 0.8mm) and this increases the effective airflow area, for improved cooling efficiency.
MSI has also started rifle-barreling its heat pipes(!) The scored, spiral grooves increase the internal surface area (more so than regular straight grooves, apparently) and this ‘strengthens key thermal paths’ – improving heat capture and bringing the temperature down by ‘six to eight per cent.’
Also being used is a Diamond-Copper composite baseplate which creates a ‘high-conductivity thermal path’ from the GPU core to the heatsink (accelerating heat transfer).
There are also diamond-composite thermal pads to improve the heat transfer from memory components to the cooling module, for better thermal control when under heavy load.
Everything is designed to work together holistically to maximise the efficiency of all the heat-channels throughout the cooling module.
We’d be keen to see the white paper on how all this stuff works, frankly. It sounds a bit like mixing gum n’ nuts, but there’s little reason to doubt the performance numbers. And who adds (invisible) diamonds (albeit industrial diamonds) to an entire product line, just for show (and even bragging rights) if it’s not cost effective?
There’s no word on when this technology will appear, yet – just that it will adorn MSI’s next-gen products.
Last Updated on July 1, 2026 by Nick Ross
