XERON Showcases PC Hardware Ecosystem At Gamescom 2026 As It Expands Into European Market

Chinese PC hardware brand, XERON, will exhibit its full range of PC components at Gamescom 2026 in Cologne, Germany, marking the company’s first major exhibition in Europe.

The company will be present at Koelnmesse from August 26 to 30, occupying booth F-049g in Hall 03.2. The Gamescom appearance follows XERON’s global debut at Computex 2026 earlier this year.

XERON’s lineup at the show spans PC cases, power supplies, cooling solutions, thermal interface materials and accessories. The company is also using the event to seek distributors, retailers and channel partners across Europe as part of a broader regional expansion strategy.

C-LAB chassis leads the showcase

The centrepiece of XERON’s booth will be the C-LAB, a PC case the company describes as an “art gallery” chassis that combines performance with industrial design aesthetics.

The C-LAB is designed as a showcase chassis, positioning the personal computer as both a functional system and a visual centrepiece. It reflects XERON’s broader design philosophy, which the company calls “From Origin, Beyond Boundaries” – a focus on returning to first principles through purposeful design.

T1000 AIO cooler with diamond-copper cold plates

XERON will also display the T1000, an all-in-one liquid cooler that uses two technologies aimed at improving heat transfer for modern processors.

The T1000 features a diamond-copper composite cold plate that replaces the conventional solid copper plate found in most AIO liquid coolers. According to XERON, the composite material delivers approximately 1.5 to 2.5 times the thermal conductivity of copper, enabling faster heat transfer away from the CPU and reducing temperatures by around 5 degrees Celsius under comparable conditions.

The cooler also employs an independent dual-loop cooling system that combines a sealed liquid metal loop with a conventional coolant loop. Rather than relying solely on coolant, the T1000 uses liquid metal to absorb heat directly from the CPU before transferring it through a copper interface to the primary liquid cooling loop.

The dual-loop design spreads concentrated heat across a larger surface area before it reaches the coolant, which XERON claims improves heat transfer efficiency and helps the radiator dissipate heat more effectively. The company says this reduces temperature spikes during sudden CPU load changes while minimising fan ramp-up and operating noise.

Broad power supply range from 550W to 3,000W

XERON will display several power supply families covering a wide range of capacities and form factors.

The LUX PT Series consists of fully modular ATX 3.1 power supplies available in 750W, 850W, 1,000W and 1,200W capacities. The units carry 80 PLUS Titanium and PPLP Titanium certifications, and feature Japanese capacitors, pure copper cables and a bridge-less APFC circuit with LLC and D2D architecture.

For AI workstations and professional systems, the LUX PT WS Series includes 1,650W and 2,500W models with multiple 12V-2×6 connectors to support multi-GPU configurations. Both models are built around Titanium-level efficiency components.

The MAX PG Series targets the mid-range segment with 650W, 750W and 850W models carrying 80 PLUS Gold, Cybenetics Gold and PPLP Gold certifications in a compact 140mm housing.

The MAX PB Series offers mainstream ATX 3.1 power supplies from 550W to 850W with 80 PLUS 230V EU Bronze certification, while the MAX PS Series covers the small form factor segment with fully modular SFX12V 4.1 and ATX12V 3.1 units in 650W, 750W, 850W and 1,000W capacities.

The MAX PX Series expands the SFX lineup with 80 PLUS Platinum certified models in 750W, 850W and 1,000W capacities.

At the top end, the MAX P3000G WS is a 3,000W 80 PLUS Gold power supply designed for AI servers and multi-GPU workstations. It supports multiple 12V-2×6 connectors and uses an APFC, Full-Bridge LLC and D2D architecture.

AIO coolers and fan lineup

Beyond the T1000, XERON will show several other cooling products.

The LUX L360 VISION is an all-in-one liquid cooler featuring a 6.67-inch curved OLED display protected by AG glass, paired with what XERON calls an Infinity Mirror Expansion panel. It uses a low-noise pump and 2,400RPM dual-curve fans rated for up to 320W TDP. The cooler includes an offset bracket that aligns the CPU hotspot with the centre of the copper cold plate, which the company claims reduces CPU temperature by 2 to 3 degrees Celsius compared to standard brackets.

The NEX L360 ARGB Series uses daisy-chain fan wiring for simplified cable management and features a Magnetic 3D Lightning Ornament alongside annular ARGB fans. It also includes the offset bracket design found in the LUX L360 VISION.

On the fan side, the MAX F120 Series uses dual-curve blades and turbulence-reduction design with a single-cable configuration. The NEX F120A and NEX F120RA ARGB fans are available in forward and reverse blade configurations, with integrated fan blades and side hollow cutouts.

Thermal interface materials

XERON will round out its Gamescom display with a range of thermal interface materials.

The LUX E71 is a liquid metal thermal interface rated at 26W/m-K, designed for systems requiring high heat transfer. The MAX E72 is a liquid metal composite thermal paste that combines liquid metal with conventional thermal paste characteristics. Its embedded liquid metal microstructure is designed to prevent shifting and leakage while maintaining consistent contact between the CPU and cooler, with thermal conductivity exceeding 8 W/m-K.

The NEX E72 and NEX E75 thermal pastes use an electrically insulated formula available in 2g and 5g capacities. Both are designed for mainstream PCs, laptops and graphics cards.

European partners sought

XERON is actively seeking distributors, retailers and strategic channel partners across Europe. The company is inviting visitors, media and potential business partners to its Gamescom booth to discuss collaboration opportunities and view its product range.

Pricing

Last Updated on July 31, 2026 by Nick Ross